Diamond Thin Multi-Wire Saw for Factory Production

The demand for high-performance semiconductor wafers made from silicon carbide (SiC) composites is rapidly growing. This advanced material requires a cutting solution that guarantees minimal subsurface damage and high geometric accuracy for optimal device performance, especially during pilot runs. The DINOSAW lab multi-wire saw is specifically engineered for SiC wafer slicing in factory R&D settings. Its high-precision tension control system and up-feed mechanism ensure low-damage, warp-free cutting, which is critical for producing reliable semiconductor wafers. This process significantly enhances material yield during process validation. Our machine's technical advantage lies in its ability to maintain stable wire speed and tension, preventing micro-cracks and delivering a superior surface finish. This precision slicing capability reduces the need for extensive lapping and polishing, saving time and cost in small-batch production. The result is perfectly sliced SiC wafers with exceptional thickness uniformity and surface quality, ready for downstream processing. This boosts throughput and yield in demanding semiconductor fabrication environments, validating the process for mass production. By integrating our small multi-wire saw, factory pilot lines can accelerate R&D and validate production processes for next-generation power electronics, unlocking new commercial opportunities with a reliable cutting technology.

The optical industry requires flawless glass components for high-precision lenses, prisms, and filters. Traditional cutting methods often introduce thermal stress and micro-cracks, compromising optical performance and increasing scrap rates during pilot runs. The DINOSAW multi-wire saw provides a superior solution for optical glass slicing. Its precise up-feed cutting and diamond wire technology minimize thermal impact, delivering clean, stress-free cuts. This machine is ideal for creating thin optical glass slices with unparalleled accuracy for trial production samples. The core technology ensures exceptional dimensional stability and flatness (e.g., ±0.02mm), critical for maintaining the refractive index and light transmission properties of the material. This precise control eliminates variability and ensures consistent quality for pilot production. The application yields perfectly uniform optical glass blanks with pristine surfaces, significantly reducing subsequent grinding and polishing efforts. This leads to faster production cycles and higher profitability for optical component manufacturers. By adopting our thin multi-wire saw for processing optical materials, your factory can produce top-tier pilot samples for lenses and components, meeting the stringent demands of the consumer electronics, medical, and defense industries.

Alumina ceramics are vital for electronic substrates and components due to their excellent thermal and electrical insulation properties. However, their hardness and brittleness make them challenging to machine without causing chipping or fractures. The DINOSAW thin multi-wire saw is expertly designed for slicing alumina ceramics with high precision. Using a fine diamond wire and a gentle up-feed motion, the machine minimizes mechanical stress, delivering clean cuts with excellent edge quality for substrates. Its advanced tensioning system and rigid frame provide the stability needed for low-damage cutting. This technology ensures tight dimensional tolerances and superior flatness, which are essential for high-density circuit printing and component mounting. This results in high-quality ceramic substrates with consistent thickness and defect-free surfaces. This reliable machining process significantly improves the yield of valuable components and reduces material waste during production. By leveraging this precision slicing machine for alumina ceramic processing, R&D teams and manufacturers can produce reliable, high-performance substrates for advanced electronics, enhancing their competitive edge in a demanding market.

High-purity graphite is a key material for battery anodes and other energy applications. The slicing process must be precise and clean to ensure optimal electrochemical performance and avoid contamination of the final anode materials. The DINOSAW multi-wire saw excels at slicing graphite blocks with precision. Its up-feed cutting method and specialized diamond wire ensure smooth surfaces and prevent chipping, preserving the structural integrity of the anode materials for consistent performance. The machine's technology focuses on controlled, low-impact cutting, which is ideal for the soft and abrasive nature of graphite. The constant tension control prevents wire vibration, resulting in highly accurate, uniform slices. This process delivers high-quality graphite anode slices with minimal material loss and excellent surface finish. This precise fabrication is critical for achieving high energy density and long cycle life in modern batteries. Implementing our thin multi-wire saw for graphite processing allows large industrial labs and battery manufacturers to refine their anode materials and accelerate the development of next-generation energy storage solutions with a reliable, efficient technology.